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25 Layer FR4 PCB Custom PCB Boards Immersion Gold for Bluetooth Panel Board

Categories PCB Board Fabrication
Place of Origin: China
Brand Name: LT Circuit
Certification: UL E354810,SGS
MOQ: NO MOQ
Packaging Details: 20pcs/vacuum bag+export packing
Delivery Time: 5-12Days
Payment Terms: T/T,OA, L/C, Western Union
Supply Ability: Ten thousand square meters/month
Price: Negotiable
Company Info.
LT CIRCUIT CO.,LTD
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25 Layer FR4 PCB Custom PCB Boards Immersion Gold for Bluetooth Panel Board


25 Layer FR4 PCB Custom PCB Boards Immersion Gold for Bluetooth Panel Board


Description


1. Professional manufacturer of PCB and PCB assembly specialized in single-sided PCB, double-sided PCB, multilayer PCB, PCB layout and design and PCB assembly

2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180

3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger


Application


Products are applied to a wide range of High-tech industries such as: LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect. By unremitting work and effort to the marketing, products exports to American, Canada, Europe counties, Africa and other Asia-pacific countries


Advantage


1. PCB factory directly

2. PCB Have the comprehensive quality control system

3. PCB good price

4. PCB quick turn delivery time from 48hours.

5. PCB certification(ISO/UL E354810/RoHS)

6. 8 years experience in exporting service

7. PCB is no MOQ/MOV.

8. PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting


Specifications


 

High precision prototype

PCB bulk production

Max Layers

1-28 layers

1-14 layers

MIN Line width(mil)

3mil

4mil

MIN Line space(mil)

3mil

4mil

Min via (mechanical drilling)

Board thickness≤1.2mm

0.15mm

0.2mm

Board thickness≤2.5mm

0.2mm

0.3mm

Board thickness>2.5mm

Aspect Ration≤13:1

Aspect Ration≤13:1

Aspect Ration

Aspect Ration≤13:1

Aspect Ration≤13:1

Board thickness

MAX

8mm

7mm

MIN

2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm

2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm

MAX Board size

610*1200mm

610*1200mm

Max copper thickness

0.5-6oz

0.5-6oz

Immersion Gold/

Gold Plated Thickness

Immersion Gold:Au,1—8u”
Gold finger:Au,1—150u”
Gold Plated:Au,1—150u”
Nickel Plated :50—500u”

 

Hole copper thick

25um 1mil

25um 1mil

Tolerance

Board thickness

Board thickness≤1.0mm:+/-0.1mm
1.0mm<Board thickness≤2.0mm:+/-10%
Board thickness>2.0mm:+/-8%

Board thickness≤1.0mm:+/-0.1mm
1.0mm<Board thickness≤2.0mm:+/-10%
Board thickness>2.0mm:+/-8%

Outline Tolerance

≤100mm:+/-0.1mm
100< ≤300mm:+/-0.15mm
>300mm:+/-0.2mm

≤100mm:+/-0.13mm
100< ≤300mm:+/-0.15mm
>300mm:+/-0.2mm

Impedance

±10%

±10%

MIN Solder mask bridge

 0.08mm

 0.10mm

Plugging Vias capability

 0.25mm--0.60mm

 0.70mm--1.00mm


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